Inspection of integrated circuit and probe card

Abstract

PURPOSE: To remarkably shorten the time of an inspection treatment by a method wherein a movement treatment to a next chip and a judgment treatment regarding a nondefective product or a defective product are constituted so as to be executed in parallel. CONSTITUTION: When a chip (a) is probed, various kinds of measurements are executed, a chip to be measured next is a chip (b 1 ) and a chip measured previously is a chip (b 3 ), a measured data on the (b 3 ) is operated, whether the (b 3 ) is nondefective or defective is judged and an inking operation in order to discriminate a nondefective product from a defective product is performed during the time to move a probing tip from the (b 3 ) to the (a) and during the time to measure the (a). Even when the probing tip is moved from the (a) to the (b 1 ), the operation, the judgment and the discrimination of the (a) are performed during the time of the movement and during the time to measure the (b 1 ). When a chip to be measured at present is the (a) and a chip to be measured next is a chip (b 4 ), a chip coming to the position of a hole P 1 for probing use is moved from the (a) to the (b 4 ). After that, an inking operation is performed by using a hole H 1 . In the same manner, when the chip is moved from the (a) to the (b 1 ), the inking operation is performed by using a hole H 4 ; when the chip is moved from the (a) to the (b 2 ), the inking operation is performed by using a hole H 3 ; when the chip is moved from the (a) to the (b 3 ), the inking operation is performed by using a hole H 2 . COPYRIGHT: (C)1992,JPO&Japio

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