Plating method


PURPOSE: To prevent the damage of a conductive film and to surely impress a cathode voltage on the conductive film by energizing the conductive film of a film lined with the conductive film and a cathode through a conductive liq. CONSTITUTION: A cathode contact tank 10 is provided at least on the preceding stage of a line, and a conductive liq. 12 is constantly supplied to a liq. feeding pipe 11 arranged in the tank 10. Cathodes 13 and 13 are vertically opposed to each other in the conductive liq. 12, a cathode voltage is impressed on the liq. 12, a film 1 lined with a conductive film passes through the liq. 12 between the cathodes 13 and 13, and a cathode voltage is impressed on the conductive film through the liq. 12. COPYRIGHT: (C)1992,JPO&Japio




Download Full PDF Version (Non-Commercial Use)

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)


Cited By (4)

    Publication numberPublication dateAssigneeTitle
    JP-2006055952-AMarch 02, 2006Asahi Diamond Industrial Co Ltd, 旭ダイヤモンド工業株式会社Device and method of manufacturing ultra-long tool
    JP-2007016316-AJanuary 25, 2007Hoellmueller Maschinenbau Gmbh, ヘルミューラー マシネンバウ ゲゼルシャフト ミット ベシュレンクテル ハフツングApparatus and process for electrolytically treating of foils from roller to roller
    JP-2012526194-AOctober 25, 2012プレーティング イノベーションズ エッセ.エルレ.エルレ.PLATING INNOVATIONS s.r.l.棒の連続電解表面仕上げ装置及び方法
    JP-H06101100-AApril 12, 1994Toyo Kohan Co Ltd, 東洋鋼鈑株式会社電気めっき方法および装置