Package of electronic component and mounting structure thereof


PURPOSE: To prevent a short-circuit between leads at the time of soldering and to thin the thickness after mounting components by alternately arranging gull-wing type leads and the almost straight leads in the outer lead part of a package. CONSTITUTION: In lead part 5 of a surface mount type IC 1, gull-wing type IC leads 5a and IC leads 5b being straight and given no lead processing are provided and these leads 5a and 5b are alternately arranged. When the surface mount type IC is soldered on a printed wiring board 4, mounting is performed on a counterbored part 6 provided on the printed wiring board 4. As a result, an interlead distance can be largely taken so as to prevent an interlead short- circuit at the time of soldering. COPYRIGHT: (C)1992,JPO&Japio




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Patent Citations (2)

    Publication numberPublication dateAssigneeTitle
    JP-H01258453-AOctober 16, 1989Toshiba CorpSemiconductor device
    JP-S5425463-AFebruary 26, 1979Hitachi LtdPrint substrate assembly

NO-Patent Citations (0)


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    US-5821457-AOctober 13, 1998The Panda ProjectSemiconductor die carrier having a dielectric epoxy between adjacent leads
    US-5824950-AOctober 20, 1998The Panda ProjectLow profile semiconductor die carrier
    US-5969416-AOctober 19, 1999Samsung Aerospace Industries, Ltd.Ball grid array semiconductor package
    US-6141869-ANovember 07, 2000Silicon Bandwidth, Inc.Apparatus for and method of manufacturing a semiconductor die carrier
    US-6339191-B1January 15, 2002Silicon Bandwidth Inc.Prefabricated semiconductor chip carrier
    US-6828511-B2December 07, 2004Silicon Bandwidth Inc.Prefabricated semiconductor chip carrier
    US-6857173-B1February 22, 2005Silicon Bandwidth, Inc.Apparatus for and method of manufacturing a semiconductor die carrier
    US-6977432-B2December 20, 2005Quantum Leap Packaging, Inc.Prefabricated semiconductor chip carrier
    WO-9641507-A1December 19, 1996The Panda ProjectSubstrat extra-plat pour puce de semiconducteur