Small-sized electric apparatus

Abstract

PURPOSE: To facilitate a soldering work, and to prevent a conductive piece from floating from a circuit board formed by so integrally filling and molding with insulating synthetic resin as to expose parts of conductive pieces from both upper and lower faces by forming the exposing area of the piece with the soldering face side to be wider than the area exposed with a component placing side. CONSTITUTION: A circuit board 51 to be contained in a body case, and a component to be placed thereon are provided. The board 51 is so buried and covered with insulating synthetic resin as to expose parts of conductive pieces 73 from both upper and lower faces. The component is placed on a land 51a of one face of the board 51, leads l extended from the component are inserted to the exposed part of the piece 73 to protrude to the side of a face 51b to be soldered of the other face of the board 51, and the protrusion end is soldered to the piece 73. The piece 73 is so formed that the exposed area with the side of the face 51b ls wider than the exposed area with the side of the face 51a. COPYRIGHT: (C)1991,JPO&Japio

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Patent Citations (2)

    Publication numberPublication dateAssigneeTitle
    JP-S4942860-B2November 18, 1974
    JP-S5429062-AMarch 03, 1979Matsushita Electric Works LtdWiring board for electrical appliances

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Cited By (5)

    Publication numberPublication dateAssigneeTitle
    EP-0722264-A2July 17, 1996Kabushiki Kaisha ToshibaSchaltungsplatte und Schaltungsplattenanordnung
    EP-0722264-A3December 29, 1997Kabushiki Kaisha ToshibaSchaltungsplatte und Schaltungsplattenanordnung
    EP-1272016-A2January 02, 2003Canon Kabushiki KaishaResin-molded board
    EP-1272016-A3October 29, 2003Canon Kabushiki KaishaPanneau moulé en résine
    US-5777851-AJuly 07, 1998Kabushiki Kaisha ToshibaCircuit board having a wiring structure buried in a resin layer