Formation of printed circuit board

Abstract

PURPOSE:To obtain an entirely new effective printed circuit board by forming a conductor circuit on a thermoplastic resin board by conductive paste and heating and pressurizing it to bury in the board. CONSTITUTION:Conductor circuits A, B, C are formed by conductive paste on a thermoplastic resin board 1. Thereafter they are buried in the board 1 by heating and pressurizing them. The material of the board 1 is a resin material so far softened to bury the circuits A, B, C in the board by temperature and pressure. Solderable conductive paste may be used. Thereby an entirely new effective printed circuit board can be obtained.

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Cited By (6)

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    US-6824857-B2November 30, 2004Nashua CorporationCircuit elements having an embedded conductive trace and methods of manufacture
    US-7340825-B2March 11, 2008Harris CorporationMethod of making a transformer
    US-7381902-B2June 03, 2008Matsushita Electric Industrial Co., Ltd.Wiring board and method of manufacturing the same
    US-7391293-B2June 24, 2008Harris CorporationTransformer and associated method of making using liquid crystal polymer (LCP) material
    US-7509727-B2March 31, 2009Harris CorporationMethod of making a transformer
    WO-02080637-A1October 10, 2002Nashua CorporationElements de circuit possedant une trace conductrice enfouie et procedes de fabrication associes