PURPOSE:To obtain an entirely new effective printed circuit board by forming a conductor circuit on a thermoplastic resin board by conductive paste and heating and pressurizing it to bury in the board. CONSTITUTION:Conductor circuits A, B, C are formed by conductive paste on a thermoplastic resin board 1. Thereafter they are buried in the board 1 by heating and pressurizing them. The material of the board 1 is a resin material so far softened to bury the circuits A, B, C in the board by temperature and pressure. Solderable conductive paste may be used. Thereby an entirely new effective printed circuit board can be obtained.